Global Advanced Chip Packaging Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2023-2030 - (By Technology Coverage, By Packaging Coverage, By End-use Industry Coverage, By Geographic Coverage and By Company)
Published Date: Nov 2023 |
Format:
| No. of Pages: 168
Industry: Information & Communications Technology | Author Name: Harshad
The growth of the advanced chip packaging market is ascribed to the rise in consumer electronics demand, the semiconductor industry's expansion, the adoption of the Internet of Things, technological advancements, and major manufacturers' ongoing expenditures in cutting-edge packaging technologies.
Toward the end of 2030, the global market for advanced chip packaging is likely to be reaching around US$52.7 Bn.
Asia Pacific is and will most likely remain the leading regional market for advanced chip packaging technology.
The fan-out wafer-level packaging (FOWLP) category maintained a sizeable revenue share of the global market in 2022. The trend will prevail through 2030. By end-use industry, the electronics industry represents the leading segment of the market.
Intel Corporation, Samsung Electronics Co. Ltd., Amkor Technology, Inc., Qualcomm Technologies Inc., Synapse Electronique, Universal Instruments Corporation, and Toshiba Corporation are some of the biggest names in the advanced chip packaging industry.
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