Fairfield Market Research Advanced Semiconductor Packaging Market Size, Share 2030

Advanced Semiconductor Packaging Market

Global Advanced Semiconductor Packaging Industry Analysis, Size, Share, Growth, Trends, Regional Outlook, and Forecast 2023-2030 (By Packaging Type Coverage, By Application Coverage, By Geographic Coverage and By Company)

Published Date: Aug 2023 | Format: | No. of Pages: 225

Industry: Information & Communications Technology


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The global advanced semiconductor packaging market is all set for a significant rate of progression at around 10.8% CAGR between the years of forecast 2023 and 2030, reaching an estimated market value of more than US$90 Bn by the end of 2030.

Market Analysis in Brief

The market for advanced semiconductor packaging focuses on creating, integrating, and developing advanced packaging technologies for semiconductor devices. Integrated circuits (ICs) or chips need to be protected and connected, and semiconductor packaging helps by offering mechanical support, thermal control, and electrical connections. Various packaging technologies, including 2.5D and 3D packaging, fan-out wafer-level packaging (FOWLP), system-in-package (SiP), flip-chip packing, wafer-level chip-scale packaging (WLCSP), and others, are used in the advanced semiconductor packaging. Due to increased demand from the funding and investment community, the global market for advanced semiconductor packaging has been rising strongly in recent years. Consumers' changing preferences and choices for the newest gadgets and technologies, together with ongoing innovation in the consumer electronics industry, are some of the major reasons driving the growth of the advanced semiconductor packaging market.

Advanced Semiconductor Packaging Market

The complexity of the ICs results in much higher wafer production costs. Advanced semiconductor packaging's adoption is hampered by the associated high cost owing to the packaging of numerous chips and integrated circuits with complex patterning. Chiplets, 3D stacking, and high-bandwidth memory (HBM) integration are examples of advanced semiconductor packaging technologies that efficiently integrate processors, memory, and accelerators for AI, and machine learning workloads. These packaging options speed up data processing, use less energy, and help meet the rising need for AI-driven applications across a range of industries, including healthcare, autonomous driving, and finance.

Key Report Findings

  • The global market for advanced semiconductor packaging will expand at a significant rate of 10.8% CAGR between 2023 and 2030.
  • The demand for advanced semiconductor packaging is rising due to technological advancements in semiconductors.
  • Demand for fan-out wafer level packaging (FAN-OUT WAFER LEVEL) remains higher in the advanced semiconductor packaging market.
  • The consumer electronics category held the largest revenue share of the advanced semiconductor packaging market in 2022.
  • Asia Pacific will continue to lead its way, whereas North America's advanced semiconductor packaging market will experience the strongest growth till 2030.

Growth Drivers

Skyrocketing Sales of Consumer Electronics, and Constant R&D Investments from Key Manufacturers

The advanced semiconductor packaging market is expected to rise because of the rising demand for consumer electronics and ongoing investments by major players in R&D.  The utilisation of consumer electronics products, including smartphones, tablets, laptops, smart TVs, gaming consoles, and smart home appliances, is constantly expanding. The miniaturisation, greater performance, and expanded usefulness of these devices are all made possible by advanced semiconductor packaging. The demand for sophisticated packaging solutions grows in tandem with customer demand for devices that are smaller, more powerful, and packed with features.

Leading semiconductor producers, packaging businesses, and IT titans all actively spend in R&D efforts to continuously advance packaging technologies. The development of cutting-edge packaging solutions with higher degrees of integration, better thermal management, increased electrical performance, and cost optimisation is the main emphasis of these initiatives. Major players' investments in R&D promote developing and commercialising cutting-edge packaging technologies, which drive market growth.

Advent of Semiconductor Technology

The expanding semiconductor industry and semiconductor technological advancements significantly influence the growth of the advanced semiconductor packaging market. The need for semiconductors is rising across many industries, including consumer electronics, automotive, industrial automation, healthcare, and telecommunications which is causing the semiconductor business to expand rapidly. To fulfil the demands of these various applications, innovative packaging solutions rise as the semiconductor industry develops.

Advanced packaging technologies make it possible to integrate, miniaturise, and improve the performance of semiconductor devices, facilitating the expansion of the entire semiconductor industry. After the catastrophic impacts of the coronavirus on the semiconductor industry, the Indian government approved a US$10 Bn incentive plan in December 2021. These factors would encourage the use of cutting-edge semiconductor packaging, which in turn would accelerate market expansion.

Data centers, cloud computing, machine learning, and deep learning are among high-performance computing (HPC), and Artificial Intelligence (AI) applications in high demand. These applications need cutting-edge semiconductors that can process massive volumes of data fast and effectively. The integration of heterogeneous components, such as CPUs, GPUs, RAM, and accelerators, into a single device, is made possible by advanced packaging technologies like 2.5D/3D packaging and chiplets leading to increased interconnectivity, lowered power consumption, and boosting performance.

Market Challenges

The Complexity of Integrated Circuits, and High Costs of Designing and Manufacturing

The complexity of integrated circuits and the high cost of designing and producing advanced semiconductor packaging solutions are two significant barriers that may limit market growth. With every new technological innovation, integrated circuits get more and more complicated. Complex interconnects, heterogeneous component integration, effective heat management, and other advanced packaging techniques are required to handle this complexity.

Designing and executing packaging solutions that satisfy these complicated requirements can be difficult because they demand advanced design techniques, simulation tools, and knowledge of packaging technologies, which may increase development time, expense, and potential technical challenges.

Advanced semiconductor packaging solutions are frequently developed and manufactured using complicated procedures, materials, and tools, which might increase costs. To guarantee the packaging solutions' dependability, performance, and manufacturability, the design stage necessitates investment in specialised design tools, simulation software, and knowledge.

Furthermore, producing sophisticated packaging, such as wafer-level or 2.5D/3D packaging, can be capital-intensive. Especially for price-sensitive industries or applications that prioritise cost optimisation, the high cost of design and manufacture may restrict the adoption of innovative packaging technologies.

Overview of Key Segments

Fan-out Wafer Level Packaging (FAN-OUT WAFER LEVEL) Remains a Dominant Segment

FAN-OUT WAFER LEVEL dominates the advanced semiconductor packaging market due to rising consumer demand for electronics, technological advancements towards heterogeneous integration, and improved performance and stability of FOWLP. Mobile gadgets, including smartphones, tablets, smartwatches, and other consumer electronics, frequently use FAN-OUT WAFER LEVEL. It is the perfect solution for creating smaller, thinner devices without sacrificing performance due to its small form size and great integration potential. By combining many chips, such as application processors, memory, power management units, and sensors, into a single package, FAN-OUT WAFER LEVEL improves the performance and functionality of electronic devices.

Sensors and microelectromechanical systems (MEMS) are essential components in a variety of industries, including industrial, automotive, medical, and consumer electronics. Due to its small form factor, high interconnect density, and enhanced electrical performance, FAN-OUT WAFER LEVEL provides a fantastic platform for packaging MEMS and sensors. It makes it possible to integrate MEMS components, sensor chips, and signal conditioning circuitry, resulting in small but incredibly effective sensor modules.

Consumer Electronics Industry Top Demand Generator

The consumer electronics category is expected to dominate the advanced semiconductor packaging market during the forecast period. Advanced semiconductor packaging is essential for producing smaller, more potent, and feature-rich gadgets in the consumer electronics sector. High-resolution display technologies like organic light emitting diode (OLED), and micro-LED display screens greatly benefit from advanced semiconductor packaging.

The display driver ICs are connected to the display panels via flip-chip packaging and chip-on-glass (COG) packaging techniques, ensuring high-speed data transfer and effective power distribution. These packaging options make it possible to create thin, flexible displays, have strong contrast ratios, and use little power.

Smart TVs use cutting-edge semiconductor packing techniques to offer features like networking, multimedia processing, and high-resolution screens. When application processors, graphics chips, memory, and other components are integrated into smart TVs, performance and power efficiency are improved, and capabilities like video streaming, voice control, and integration with smart homes are made possible. Smart TVs frequently use flip-chip packaging and COG packing to guarantee high-speed data transfer and small form factors. These illustrations demonstrate the crucial role that cutting-edge semiconductor packaging plays in the consumer electronics sector.

Growth Opportunities Across Regions

Asia Pacific Represents the Largest Advanced Semiconductor Packaging Market

Due to the rapidly expanding semiconductor industry, the advanced packaging market will continue to dominate in the Asia Pacific region. Key countries like China, South Korea, Taiwan, and Japan comprise prominent players as major semiconductor manufacturing hubs that provide significant prospects for cutting-edge semiconductor packaging solutions. The region's growing need for innovative packaging technologies to meet performance, miniaturisation, and power efficiency needs is driven by the rising demand for automotive, consumer electronics, and future technologies like 5G, AI, and IoT.

Furthermore, advanced driver assistance systems (ADAS) and autonomous driving technologies are increasingly important in Japan's robust automobile sector. Advanced semiconductor packaging technologies are crucial in automotive semiconductor applications owing to their durability, temperature control, and high-performance interconnects. The integration of sensors, processors, and memory in ADAS systems is made possible by packaging technologies, including flip-chip packaging, chip-on-glass (COG), and system-in-package (SiP), which enhance vehicle intelligence and safety.

North America to Demonstrate the Fastest Growth Potential

The market for advanced semiconductor packaging across North America will display a significant CAGR during the forecast period. North America is at the forefront of AI and ML technology, concentrating on creating cutting-edge hardware to support these applications. Additionally, the adoption of electric vehicles (EVs) and sustainable transportation solutions is increasing significantly in the US. To handle power electronics, motor control, battery management systems, and ADAS, advanced semiconductor packaging technologies are crucial in EVs. The US market for innovative packaging solutions with high reliability, efficient thermal management, and small form factors will be driven by the rising demand for EVs and sustainable transportation options.

Advanced Semiconductor Packaging Market: Competitive Landscape

Some of the leading players at the forefront in the advanced semiconductor packaging market space include Advanced Semiconductor Engineering, Inc., Advanced Micro Devices, Inc. (AMD), Intel Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology (JCET), STMicroelectronics N.V., Hitachi Chemical, Infineon, Avery Dennison, ASE Group, Kyocera, China Wafer Level CSP, Sumitomo Chemical, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Tongfu Microelectronics, Nepes, Powertech Technology (PTI), King Yuan Electronics, SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.

Recent Notable Developments

  • July 2021, Intel announced the Foveros Direct and Foveros Omni 3D packaging technologies. These are created to maximise power and improve integrated circuit efficiency and reliability. Intel's market share in advanced semiconductor packaging is expected to rise as a result.
  • In October 2022, Advanced Semiconductor Engineering, Inc. announced the industry’s first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging solution that elevates the performance for High Performance Computing (HPC), under the ASE VIPack™ platform.
  • In March 2023, Advanced Semiconductor Engineering, Inc. (ASE), announced its most advanced Fan-Out-Package-on-Package (FOPoP) solution, developed to lower latency and deliver exceptional bandwidth advantages for the dynamic mobile and networking markets.
  • In June 2023, Amkor Technology, Inc. a leading provider of semiconductor packaging and test services and the no. 1 automotive OSAT, is innovating advanced packaging to enable the car of the future. Amkor continues to support the industry with advanced packaging for silicon carbide power devices and modules and MEMS technologies to realise the needs of sustainable and efficient vehicles, now and in the future.

The Global Advanced Semiconductor Packaging Market is Segmented as Below:

By Packaging Type

  • Fan-out Wafer Level Package (FO WLP)
  • 5D/3D
  • Fan-in Wafer Level Package (FI WLP)
  • Flip Chip

By Application

  • Automotive
  • Aerospace and Defence
  • Medical Devices
  • Consumer Electronics
  • Other

By Geographic Coverage

  • North America
    • United States
    • Canada
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East and Africa
    • GCC
    • South Africa
    • Rest of Middle East and Africa

Leading Companies

1. Executive Summary
     1.1. Global Advanced Semiconductor Packaging Market Snapshot
     1.2. Future Projections
     1.3. Key Market Trends
     1.4. Regional Snapshot, by Value, 2022
     1.5. Analyst Recommendations

2. Market Overview
     2.1. Market Definitions and Segmentations
     2.2. Market Dynamics
            2.2.1. Drivers
            2.2.2. Restraints
            2.2.3. Market Opportunities
     2.3. Value Chain Analysis
     2.4. Porter’s Five Forces Analysis
     2.5. Covid-19 Impact Analysis
            2.5.1. Supply
            2.5.2. Demand
     2.6. Impact of Ukraine-Russia Conflict
     2.7. Economic Overview
            2.7.1. World Economic Projections
     2.8. PESTLE Analysis

3. Global Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
     3.1. Global Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
            3.1.1. Key Highlights
                  3.1.1.1. FO WLP
                  3.1.1.2. 2.5D/3D
                  3.1.1.3. FI WLP
                  3.1.1.4. Flip Chip
     3.2. Global Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
            3.2.1. Key Highlights
                  3.2.1.1. Automotive
                  3.2.1.2. Aerospace and Defense
                  3.2.1.3. Medical Devices
                  3.2.1.4. Consumer Electronics
                  3.2.1.5. Other
     3.3. Global Advanced Semiconductor Packaging Market Outlook, by Region, Value (US$ Bn), 2018 – 2030
            3.3.1. Key Highlights
                  3.3.1.1. North America
                  3.3.1.2. Europe
                  3.3.1.3. Asia Pacific
                  3.3.1.4. Latin America
                  3.3.1.5. Middle East & Africa

4. North America Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
     4.1. North America Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
            4.1.1. Key Highlights
                  4.1.1.1. FO WLP
                  4.1.1.2. 2.5D/3D
                  4.1.1.3. FI WLP
                  4.1.1.4. Flip Chip
     4.2. North America Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
            4.2.1. Key Highlights
                  4.2.1.1. Automotive
                  4.2.1.2. Aerospace and Defense
                  4.2.1.3. Medical Devices
                  4.2.1.4. Consumer Electronics
                  4.2.1.5. Other
            4.2.2. Market Attractiveness Analysis
     4.3. North America Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
            4.3.1. Key Highlights
                  4.3.1.1. U.S. Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  4.3.1.2. U.S. Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  4.3.1.3. Canada Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  4.3.1.4. Canada Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
            4.3.2. BPS Analysis/Market Attractiveness Analysis

5. Europe Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
     5.1. Europe Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
            5.1.1. Key Highlights
                  5.1.1.1. FO WLP
                  5.1.1.2. 2.5D/3D
                  5.1.1.3. FI WLP
                  5.1.1.4. Flip Chip
     5.2. Europe Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
            5.2.1. Key Highlights
                  5.2.1.1. Automotive
                  5.2.1.2. Aerospace and Defense
                  5.2.1.3. Medical Devices
                  5.2.1.4. Consumer Electronics
                  5.2.1.5. Other
            5.2.2. BPS Analysis/Market Attractiveness Analysis
     5.3. Europe Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
            5.3.1. Key Highlights
                  5.3.1.1. Germany Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.2. Germany Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  5.3.1.3. U.K. Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.4. U.K. Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  5.3.1.5. France Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.6. France Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  5.3.1.7. Italy Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.8. Italy Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  5.3.1.9. Spain Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.10. Spain Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  5.3.1.11. Spain Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.12. Russia Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  5.3.1.13. Rest of Europe Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  5.3.1.14. Rest of Europe Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
            5.3.2. BPS Analysis/Market Attractiveness Analysis

6. Asia Pacific Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
     6.1. Asia Pacific Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
            6.1.1. Key Highlights
                  6.1.1.1. FO WLP
                  6.1.1.2. 2.5D/3D
                  6.1.1.3. FI WLP
                  6.1.1.4. Flip Chip
     6.2. Asia Pacific Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
            6.2.1. Key Highlights
                  6.2.1.1. Automotive
                  6.2.1.2. Aerospace and Defense
                  6.2.1.3. Medical Devices
                  6.2.1.4. Consumer Electronics
                  6.2.1.5. Other
            6.2.2. BPS Analysis/Market Attractiveness Analysis
     6.3. Asia Pacific Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
            6.3.1. Key Highlights
                  6.3.1.1. China Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  6.3.1.2. China Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  6.3.1.3. Japan Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  6.3.1.4. Japan Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  6.3.1.5. South Korea Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  6.3.1.6. South Korea Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  6.3.1.7. India Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  6.3.1.8. India Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  6.3.1.9. Southeast Asia Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  6.3.1.10. Southeast Asia Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  6.3.1.11. Rest of Asia Pacific Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  6.3.1.12. Rest of Asia Pacific Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
            6.3.2. BPS Analysis/Market Attractiveness Analysis

7. Latin America Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
     7.1. Latin America Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
            7.1.1. Key Highlights
                  7.1.1.1. FO WLP
                  7.1.1.2. 2.5D/3D
                  7.1.1.3. FI WLP
                  7.1.1.4. Flip Chip
     7.2. Latin America Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
            7.2.1. Key Highlights
                  7.2.1.1. Automotive
                  7.2.1.2. Aerospace and Defense
                  7.2.1.3. Medical Devices
                  7.2.1.4. Consumer Electronics
                  7.2.1.5. Other
            7.2.2. BPS Analysis/Market Attractiveness Analysis
     7.3. Latin America Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
            7.3.1. Key Highlights
                  7.3.1.1. Brazil Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  7.3.1.2. Brazil Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  7.3.1.3. Mexico Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  7.3.1.4. Mexico Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  7.3.1.5. Rest of Latin America Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  7.3.1.6. Rest of Latin America Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
            7.3.2. BPS Analysis/Market Attractiveness Analysis

8. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, 2018 – 2030
     8.1. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, by Packaging Type, Value (US$ Bn), 2018 – 2030
            8.1.1. Key Highlights
                  8.1.1.1. FO WLP
                  8.1.1.2. 2.5D/3D
                  8.1.1.3. FI WLP
                  8.1.1.4. Flip Chip
     8.2. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, by Application, Value (US$ Bn), 2018 – 2030
            8.2.1. Key Highlights
                  8.2.1.1. Automotive
                  8.2.1.2. Aerospace and Defense
                  8.2.1.3. Medical Devices
                  8.2.1.4. Consumer Electronics
                  8.2.1.5. Other
            8.2.2. BPS Analysis/Market Attractiveness Analysis
     8.3. Middle East & Africa Advanced Semiconductor Packaging Market Outlook, by Country, Value (US$ Bn), 2018 – 2030
            8.3.1. Key Highlights
                  8.3.1.1. GCC Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  8.3.1.2. GCC Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  8.3.1.3. South Africa Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  8.3.1.4. South Africa Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
                  8.3.1.5. Rest of Middle East & Africa Advanced Semiconductor Packaging Market by Packaging Type, Value (US$ Bn), 2018 – 2030
                  8.3.1.6. Rest of Middle East & Africa Advanced Semiconductor Packaging Market Application, Value (US$ Bn), 2018 – 2030
            8.3.2. BPS Analysis/Market Attractiveness Analysis

9. Competitive Landscape
     9.1. Manufacturer vs Packaging Type Heatmap
     9.2. Company Market Share Analysis, 2022
     9.3. Competitive Dashboard
     9.4. Company Profiles
            9.4.1. Advanced Semiconductor Engineering, Inc.
                  9.4.1.1. Company Overview
                  9.4.1.2. Product Portfolio
                  9.4.1.3. Financial Overview
                  9.4.1.4. Business Strategies and Development
            9.4.2. Advanced Micro Devices, Inc. (AMD)
                  9.4.2.1. Company Overview
                  9.4.2.2. Product Portfolio
                  9.4.2.3. Financial Overview
                  9.4.2.4. Business Strategies and Development
            9.4.3. Intel Corporation
                  9.4.3.1. Company Overview
                  9.4.3.2. Product Portfolio
                  9.4.3.3. Financial Overview
                  9.4.3.4. Business Strategies and Development
            9.4.4. Amkor Technology
                  9.4.4.1. Company Overview
                  9.4.4.2. Product Portfolio
                  9.4.4.3. Financial Overview
                  9.4.4.4. Business Strategies and Development
            9.4.5. STMicroelectronics N.V.
                  9.4.5.1. Company Overview
                  9.4.5.2. Product Portfolio
                  9.4.5.3. Financial Overview
                  9.4.5.4. Business Strategies and Development
            9.4.6. Hitachi Chemical
                  9.4.6.1. Company Overview
                  9.4.6.2. Product Portfolio
                  9.4.6.3. Financial Overview
                  9.4.6.4. Business Strategies and Development
            9.4.7. Infineon
                  9.4.7.1. Company Overview
                  9.4.7.2. Product Portfolio
                  9.4.7.3. Financial Overview
                  9.4.7.4. Business Strategies and Development
            9.4.8. Avery Dennison
                  9.4.8.1. Company Overview
                  9.4.8.2. Product Portfolio
                  9.4.8.3. Financial Overview
                  9.4.8.4. Business Strategies and Development
            9.4.9. Sumitomo Chemical
                  9.4.9.1. Company Overview
                  9.4.9.2. Product Portfolio
                  9.4.9.3. Business Strategies and Development
            9.4.10. ASE Group
                  9.4.10.1. Company Overview
                  9.4.10.2. Product Portfolio
                  9.4.10.3. Financial Overview
                  9.4.10.4. Business Strategies and Development
            9.4.11. Kyocera
                  9.4.11.1. Company Overview
                  9.4.11.2. Product Portfolio
                  9.4.11.3. Financial Overview
                  9.4.11.4. Business Strategies and Development
            9.4.12. China Wafer Level CSP
                  9.4.12.1. Company Overview
                  9.4.12.2. Product Portfolio
                  9.4.12.3. Financial Overview
                  9.4.12.4. Business Strategies and Development

10. Appendix
     10.1. Research Methodology
     10.2. Report Assumptions
     10.3. Acronyms and Abbreviations

BASE YEAR

HISTORICAL DATA

FORECAST PERIOD

UNITS

2022

 

2018 - 2022

2023 - 2030

Value: US$ Mn Volume: Kilo Tons

 

REPORT FEATURES

DETAILS

Packaging Type Coverage

  • Fan-out Wafer Level Package (FO WLP)
  • 2.5D/3D
  • Fan-in Wafer Level Package (FI WLP)
  • Flip Chip

Application Coverage

  • Automotive
  • Aerospace and Defence
  • Medical Devices
  • Consumer Electronics
  • Other

Geographical Coverage

  • North America
    • U.S.
    • Canada
  • Europe
    • Germany
    • France
    • Norway
    • Iceland
    • Sweden
    • Slovakia
    • Russia
    • Rest of Europe
  • Asia Pacific
    • China
    • Australia
    • India
    • Kazakhstan
    • Southeast Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Argentina
    • Rest of Latin America
  • Middle East & Africa
    • GCC
    • South Africa
    • Iran
    • Egypt
    • Mozambique
    • Rest of Middle East & Africa

Leading Companies

  • Advanced Semiconductor Engineering, Inc. (ASE) Group
  • Advanced Micro Devices, Inc. (AMD)
  • Intel Corporation
  • Amkor Technology
  • STMicroelectronics N.V.
  • Hitachi Chemical
  • Infineon
  • Avery Dennison
  • Sumitomo Chemical
  • Kyocera
  • China Wafer Level CSP
  • Others

Report Highlights

Market Estimates and Forecast, Market Dynamics, Industry Trends, Production Output, Trade Statistics, Price Trend Analysis, Competition Landscape, Grade-, Application-, Region-, Country-wise Trends & Analysis, COVID-19 Impact Analysis (Demand and Supply), Key Market Trends

FAQs : Advanced Semiconductor Packaging Market

Toward the end of forecast year 2030, the global advanced semiconductor packaging market size will reach a valuation of over US$90 Bn.

The market for advanced semiconductor packaging is all set for an impressive CAGR of 10.8% during the assessment period, 2023 - 2030.

The fan-out wafer level packaging (FAN-OUT WAFER LEVEL) continues to be the most preferred packaging type segment. By application, the consumer electronics industry is expected to remain the leading market segment throughout the years of forecast.

Asia Pacific will continue to lead the worldwide advanced semiconductor packaging industry attributing to the region’s exploding market for consumer electronics. North America on the other side is projected to display the fastest growth during the forecast period.

Some of the significant players in the worldwide advanced semiconductor packaging space include Advanced Semiconductor Engineering, Inc., Advanced Micro Devices, Inc. (AMD), Intel Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology (JCET), STMicroelectronics N.V., Hitachi Chemical, Infineon, Kyocera, China Wafer Level CSP, and Sumitomo Chemical.

Our Research Methodology

Considering the volatility of business today, traditional approaches to strategizing a game plan can be unfruitful if not detrimental. True ambiguity is no way to determine a forecast. A myriad of predetermined factors must be accounted for such as the degree of risk involved, the magnitude of circumstances, as well as conditions or consequences that are not known or unpredictable. To circumvent binary views that cast uncertainty, the application of market research intelligence to strategically posture, move, and enable actionable outcomes is necessary.

View Methodology
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