Hermetic Packaging Market

The Hermetic Packaging Market is valued at USD 4.2 Bn in 2026 and is projected to reach USD 6.2 Bn,  growing at a CAGR of 6% by 2033.

Demand of Effective Packaging of Sensitive Electronic Products to Bolster Hermetic Packaging Market Growth

Hermetics are widely used in the protection of electronic devices from external environmental conditions such as pressure, humidity, and other hazards. Hermetic packaging offers protection to sensitive parts in the electrical circuits of the device, thus pushing its use in the packaging of electronic products and consumer electronics. In addition, this packaging prevents the entry of gases and liquids and has high resilience to extreme temperatures as compared to other packaging types. In this backdrop, significant growth in the electronics sector has driven the demand for efficient packaging solutions, in turn auguring well for the hermetic packaging market.

Adoption in Implantable Medical Devices to Offer Lucrative Growth Opportunities for the Hermetic Packaging Market

Implantable medical devices are life-critical components used in restoring body functions thus improving and saving lives. Several implantable devices such as cochlear implants, neuromuscular microstimulator, implantable cardiac defibrillator and artificial vision prosthesis have sophisticated electronic circuits. Such long term implantable devices are highly susceptible to critical damage caused by body fluids over a period of time. That makes it imperative to protect these devices from body elements using advanced packaging solutions such as hermetic packaging. The use of hermetics in implantable medical devices is expected to provide new growth opportunities for the hermetic packaging market. Modernization in micro technology has resulted in the miniaturization of smart devices, albeit with an increased level of integration complexities. That said, compact and reliable packaging of microelectronic devices and components has gained high importance. This has translated into significant opportunities for market as the packaging is being used in the medical field to protect implantable medical devices from external harm. Hermetic packaging offers improved protection to the electronic circuitry present in the implantable device from the human body. This has fuelled its acceptance in the medical devices sector, in turn paving potential pathways of growth for the market.

Rising Demand for Reed Glass to Augment Growth of the Hermetic Packaging Market

Reed glass hermetic packaging is expected to witness high demand and adoption in the coming years. This is mainly owing to its functional properties that have fuelled its adoption across numerous applications backed by its highly reliable encapsulation. Reed glass is mainly used in the insulation of passive components apart from providing isolation and protection. The growing demand of reed glass can be attributed towards its characteristic features such as high dielectric rating, superior attachment characteristics to metal surfaces, superior mechanical stability across a range of operating temperatures and improved electrical insulation. This has resulted in their adoption in the automotive sector, especially in vehicles’ centralized locking systems. The reed switches can conveniently handle large number of make and break cycles without undergoing any wear and can close and open the electrical circuit without mechanical influence. In this backdrop, increasing use of reed glass in different industrial applications is expected to complement the revenue growth of the hermetic packaging market.

North America to Cement Dominance over Other Geographies in the Hermetic Packaging Market

Region wise, North America is expected to hold a significant revenue share in the hermetic packaging market. This is mainly owing to expanding aviation sector coupled with growing semiconductor industry in the region. In addition, increasing government spending on aerospace and defence in North America is poised to fuel the growth of the market. For instance, according to the United States Department of Defence, the budget for defence in 2022 grew to US$722 Bn, a US$17 Bn increase as compared to 2021. In 2023, thus budget is expected to cross US$737 Bn. This factor is projected to provide new opportunities and boost the adoption of hermetic packaging in defence applications in the region, thus contributing to the growth of its market in North America.

Furthermore, rising spending of customers on consumer electronics and growing penetration of smartphones is expected to bode well for the market. According to the Consumer Technology Association, retail sales of consumer electronics in United States touched US$442 Bn. Also, smartphones accounted for a significant share among consumer electronic retail sales in the country. This triggered the use of hermetic packaging as it provides improved protection to electronic components from external agents such as humidity, moisture, soil, and atmospheric changes including pressure and temperature. Other factors such as high demand for semiconductor silicon wafers, stable growth in the automotive sector, presence of key players and stable increase in economic growth continue to influence the hermetic packaging market. Overall, North America reflects promising scenario for the market and manufacturers can expect potential opportunities from the region in the forthcoming years.

Hermetic Packaging Market: Competitive Landscape

New product launches and collaborations and partnerships have been witnessed in the hermetic packaging market. For instance, in 2021, Avalanche Technology and Micross Components Inc. partnered to provide lowest and smallest Power Hi-Rel Non-Volatile Memory particularly for the aerospace applications. In 2022, SCHOTT launched new hermetic packaging components. The new SCHOTT LightView packaging components are innovative solutions that miniaturize and improve the opto-electronic performance for light engine systems. 

A few of the major players in the global hermetic packaging market include 

• Amkor Technology, Inc.
• Texas Instruments Incorporated
• STMicroelectronics N.V.
• Infineon Technologies AG
• Renesas Electronics Corporation
• ON Semiconductor Corp.
• Kyocera Corporation
• AVX Corporation
• Smiths Group plc
• Ultraclean Technologies
• Delphon Industries, Inc. (Plexus Corp.)
• Heraeus Holding GmbH
• Jennova, Inc.
• Southwall Technologies (A division of M/A-COM Technology Solutions)
• CeramTec GmbH

Global Hermetic Packaging Market Segmentation Can be Given as Below:

By Type

• Co-fired Ceramic
• Metal Can
• Epoxy Seal
• Ceramic Metal Sealing
• Glass Metal Sealing

By Application

• Sensors
• Photo Diodes
• MEMS
• Transistors
• Laser Chips
• Memory
• Others

By End-use Industry

• Aerospace & Defense
• Healthcare
• Automotive
• Electrical & Electronics
• Telecom
• Others

By Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East & Africa